Taiwan Semiconductor Manufacturing Company (TSMC), the world leader in chip production, has revealed plans to launch the advanced TSMC A16 technology.
The new manufacturing process, which uses 1.6 nanometer technology, is scheduled to enter production towards the end of 2026. The A16 technology promises significant improvements in performance and energy efficiency compared to previous generations.
The TSMC A16 technology will use gate-all-around nanosheet transistors (GAAFET) and will benefit from an innovation called Super Power Rail (SPR), which improves the power supply and transistor density.
This is expected to offer a performance increase of up to 10% and a reduction in power consumption of up to 20% compared to the previous 2nm process, known as N2P, according to the manufacturer.
With what advanced technologies better TSMC A16
In addition, TSMC introduced the concept of System-on-Wafer (SoW), which allows the integration of multiple dies on a single wafer, thereby optimizing space and computing power. The company also introduced NanoFlex technology for nanofoil transistors, which gives designers the option to choose between shorter cells for energy efficiency or taller cells for superior performance.
TSMC also announced the launch of N4C technology, which will reduce production costs by up to 8.5% and is compatible with existing N4P technology. At the same time, the company is also developing COUPE technology, which combines electrical chips with photonic chips to improve data transmission, especially in artificial intelligence applications.
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Tags: TSMC revealed plans release advanced TSMC A16 technology
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