The Apple Watch X is billed as the next big update to Apple’s smartwatch lineup, promising to add even more innovative features. A recent rumor from Digitimes sources suggests that the new model will include a thinner motherboarda step that could allow additional hardware to be added without increasing the size of the watch.
According to reports, Apple would adopt resin-coated copper (RCC) motherboard technology developed by Nan Ya PCB, a longtime Apple collaborator. This technology not only replaces traditional nonconductive layers with something much more space-efficient, but also offers the ability to squeeze multiple components into the same physical space.
Despite the reduced size of the motherboard, the external dimensions of the watch could remain unchanged, which means that Apple could use sadditional patio to integrate a larger battery or new features like blood pressure monitoring, a frequently discussed topic in tech circles.
However, skepticism remains necessary because the analyst Ming-Chi Kuo indicates that the RCC technology may not be ready for release until the third quarter of 2024, which could mean that it will not be included in the model Apple Watch Series X scheduled for release that year. Instead, Kuo suggests that this technology could debut in the iPhone 17 in 2025 due to concerns about its fragility.
Therefore, although the outlook is promising for Apple Watch Xit remains to be seen whether this new technology will be implemented in time to influence the next generation of devices.
Tags: thin motherboard means Apple Watch
